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Conference Tracks Details

Advanced Packaging Track

Advanced Packaging (APT) Track

Advances in 1st level packaging and assembly

Topic Ideas:

  • Innovations in package materials, structures and assembly processes

  • Advances in CSP, FCBGA, FCCSP, bumping, 2.5/3D, SiP, PoP, PiP, in homogeneous and other novel integrations

  • Component and board level reliability of electronic packaging and other components

  • Unique application environments and challenging mission profiles

  • Materials improvements or innovations to address reliability or hazardous substance restrictions

  • First and second level interconnect, including Cu wire, Ag wire, Copper Pillar, lead finishes, wettable flanks, novel alloys

Test and Inspecton Track

Test and Inspection (INS) Track

Ensuring product reliability short & long-term

  • Metrology

  • Component Test Methodologies

  • Component Inspection Methodologies

  • Board Test Methodologies

  • Board Inspection Methodologies

  • Reliability Assessment Methods

  • Short-term and Long-term Reliability Testing Methods

  • Test Data Collection, Aggregation, Interpretation, and Use for Manufacturing Effectiveness and Excellence, Including Industry 4.0 Applications

  • System-Level and Custom Test Methodologies

  • Failure Analysis and Root Cause Identification Techniques

  • Test Plan Creation, Implementation, and Comparative Risk Analysis of Differing Test Methodologies

  • Test Troubleshooting

  • Test Completeness

  • Reliability

  • Counterfeit Mitigation Techniques

  • Case Studies

High Performance and Reiability Track

High Performance and Reliability (HPR) Track

Addressing unique needs of electronics operating at more strenuous levels and in harsh environments

Topic Ideas:

  • Alloy and material development for interconnects addressing high performance / high reliability / high value applications

  • Soldering, Sintering, Laser reflow, and unique assembly challenges for high reliability requirements

  • Materials Selection and Test Methods for high performance and reliability.

  • Ruggedization practices for harsh environment applications

  • Thermal and mechanical solder joint reliability and predictive modeling.

  • Electronic Component Lifecycle Management/Prognostic Health Management/Monitoring (PHM)

  • Impact of Long-term Storage conditions (temperature, humidity) on reliability

  • Managing Sourcing Challenges (Counterfeit/Obsolescence)

  • Participants represent individual companies, industry consortia and working groups, universities, and research institutes. Participant business interests include medical electronics, automotive, and high reliability defense and avionics.

Low Temprature Solder Track

Low Temperature Solder (LTS) Track

Developments that can enable reflow soldering below 200°C

Topic Ideas:

  • Alloy development for interconnects addressing low temperature applications, including reliability study results

  • Microstructural characterization and structure/property relationships of low temperature materials

  • Process development for manufacturing using low temperature solder

  • Participants represent individual companies, industry consortia and working groups, universities, and research institutes. Participant business interests include low-cost consumer electronics, telecom, high-end computing equipment.

Materials for Electronics Track

Materials for Electronics (MAT) Track

New materials used in electronics assembly

Topic Ideas:

  • PC assembly materials

  • Fluxes

  • Adhesives

  • PCB manufacture: materials and processes

  • Substrate materials for low cost, robustness, 5G, etc

  • Plating processes: metallization, inner layer adhesion, or surface finishing

  • Other PCB materials or processes: solder mask, nomenclature, alignment/registration advancements

  • Innovations in creating electronic circuits from things/materials outside of PCB

 

Participants represent individual companies, industry consortia and working groups, universities, and research institutes. Participant business interests include low-cost consumer electronics, telecom, high-end computing equipment. Applications in high performance, high reliability, harsh environments are in the HPR track. Component packaging materials are included in the APT track. SnBi and other low temperature solders are in the LTS track.

Manufacturng for Excellence Track

Manufacturing for Excellence (MFX) Track

Current project work in manufacturing process areas

 

Topic Ideas:

  • Miniaturization & Cavity board assembly

  • Odd form factor

  • Increased interconnect density

  • DFX for next generation products

  • Cleaning and conformal coating challenges and solutions

  • Automation and Control (e.g. Industry 4.0, Smart Manufacturing, Supply Chain)

  • Factory Integration & Industry 4.0

  • Lean Six Sigma case studies

  • Interesting Failure Analysis and Root Cause Corrective actions

  • All aspects of the SMT process (i.e. Screen Printing, Pick and Place, Reflow & Inspection

  • The MFX sessions aim to bring together expert input and detailed case analysis as well as experiments dedicated to highlight problems and solutions of today and the future.

Interconnect Research and Reiability Symposium

Interconnect Research and Reliability (IRR) Track

Reliability testing and evaluation of soldering

Topic Ideas:

  • Thermal and mechanical attachment reliability at the board and package levels

  • Predictive modeling of attachment reliability.

  • R&D-oriented work on solder attachment and specific alloy phenomena

  • Ball drift, Bi migration or Bi stratification

  • Interconnect failure modes

  • Specific test topics include but are not limited to results of thermal cycling, thermal shock, vibration, drop/shock, and bending.

  • Papers are encouraged that advance the understanding of attachment reliability based on the science of alloy design and development, microstructural characterization, and structure/property relationships.

  • Participants represent individual companies, industry consortia and working groups, universities, and research institutes.

  • Technical Innovations (TI) Symposium

  • Manufacturability and reliability of electronic circuit boards

  • The Technical Innovation Symposium includes all manufacturing and materials that innovate the manufacturability and reliability of electronic circuit board assemblies and systems. Papers may be part of a session or combined in a panel or forum on an area of innovation. Could be a spotlight session on the expo floor (invited).

  • Share your research on:
    o    Additive Manufacturing
    o    Unique processes
    o    Novel materials
    o    Challenging environments

Technical Innovatons Symposium

Technical Innovations (TI) Track

Manufacturing & materials that innovate the manufacturability and reliability of electronic circuit board assemblies & systems

 

Topic Ideas:

  • Additive Manufacturing

  • Unique processes

  • Novel materials

  • Challenging environments

Electronics Predictive Simulation

The focus of this session is to bring together academia and industry in the field of electronics modeling and simulation using different predictive approaches such as numerical analysis as well as ML (machine learning) base data analysis and visualization to enhance electronic product quality and lower failure risk. This center of modeling and simulation welcomes research findings in all aspects of physics and intersection of ML and physical modeling from material, mechanical, thermal, electrical to ML and data driven modeling for variety of electronics applications.

  • Printed Circuit board & trace modeling

  • Current and future solder joint materials and performance modeling

  • 3D printed electronics and metal additive manufacturing simulation

  • Hardware modeling and topology optimization

  • Shock and vibration modeling of electronic systems

Women's Leadership Program

Women's Leadership Program

Promote diversity in engineering fields

 

An inclusive culture in the workforce increases organization's efficiency and creates a competitive advantage. Join us for the Women's Leadership Program at SMTA International, which aims to promote diversity in engineering fields and a culture of inclusion for women in technical conferences.

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