Accepted Presentations
Explore the accepted presentations selected for this year's conference. Curated for relevance and technical depth, these sessions highlight the knowledge, research, and practical insights you'll find at SMTA International.
Conference ➜ October 25 - 29, 2026
AME
Additively Manufactured Electronics (AME) Track
VUV-Based Hybrid Desmear Process Applicable to Small-Diameter Vias of φ10 μm
Taro Artimoto, USHIO Inc.
Co-Authors: Yukihisa Baba, Ying Ying Lim, USHIO Inc.
Embedding Electronics into High-Volume CBAM Additive Process
Nate Bode, Ph.D., Impossible Objects
Co-Author: Denis Cormier, Impossible Objects
Roll-to-Roll Additive Manufacturing of Copper Micro-Wires for SMT Circuit
Carolyn Ellinger, Eastman Kodak Company
Next Generation Direct Metallization Processes Are Adaptable to the Evolving Printed Circuit Board Material Landscape
Lindsey Mercurio, P.E., MacDermid Alpha Electronics Solutions
High Resolution Copper Printed RF Devices
Tom Rovere, Lockheed Martin
Co-Authors: Maya Chiesa, Emuobosan Enakerakpo, Eric Whiting, Lockheed Martin
APT
Advanced Packaging (APT) Track
Failure Modes in Flip Chip and Wire Bonded Packages
Mumtaz Bora, pSemi
Finite Difference Based Model to Estimate Eutectic SnPb Solder Joint Fatigue Life
Robert Darveaux, Ph.D., TMBS, LLC
Co-Authors: Andrew Mawer, NXP Semiconductors; Jean-Paul Clech, Ph.D., EPSI; Pradeep Lall, Ph.D., Auburn University
Sintered Cu Paste as a Via-Filling Material for Through-Glass Via - Investigation of Via Planarization Using CMP Process
Yoshinori Ejiri, Resonac Co., Ltd.
Co-Authors: Masumi Sakamoto, Chiaki Shimizu, Naoyuki Kikuchi, Masayoshi Nishimoto, Seiji Kai, Hiroshi Uragami, Resonac Co., Ltd.
Copper Core Solder Columns Transfer Heat from Semiconductor Chip Packages More Efficiently Than Solder Balls at Cryogenic Temperatures for Quantum, Aerospace, Data Centers and Harsh Environments
Martin Hart, Topline Corporation
Thermal-Mismatch Stress Analysis and Suppression of SEWARE in Glass Core Substrates with Multilayer ABF Build-Up Layers
Satoru Kuramochi, Dai Nippon Printing Co. Ltd.
Metal Thermal Interface Materials (TIM) Portfolio Part 1: Indium-Based Solder TIMs
Ronald Lasky, Ph.D., P.E., Indium Corporation
Co-Authors: Miloš Lazić, Kyle Aserian, Ryan Mayberry, Carson Burt, Indium Corporation
CT-Based Analysis of Cu Loading and Particle Size Effects in Cu-Sn Particulate Systems
Gilad Nave, Ph.D., SLB
Co-Authors: Md Asif Faisal Beg, Mark Kostinovsky, Mohamed El Hadachy, F. Patrick McCluskey, SLB
Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration
Charles Woychik, NHanced Semiconductors
Epoxy Adhesives with Precision Beads to Control the Air-Gaps for SMT Planar Inductor Applications
Yiliang Wu, CollTech Materials Corporation
Co-Authors: Fen Zhang, Jack Chen, CollTech Materials Corporation
Improving Cu-to-Cu Bonding Through Cu Nanoparticle Characteristics and Substrate Residual Stress Control
Albert Wu, National Central University
Co-Authors: Li-Chen Wu; Shao-Chi Chen; En-Szu Chang; Chang-Meng Wang, National Central University
INS
Test and Inspection (INS) Track
Computed Tomography (CT) vs. Computed Laminography CL for Non-Destructive Inspection of Printed Circuit Boards and Electronic Packages
Vineeth Bastin, Comet Technologies USA Inc
Co-Author: David Kruidhof, Comet Technologies USA Inc
Process Qualification to J-STD-001 Section 8 Cleanliness
Mike Bixenman, Ph.D., Magnalytix, LLC
Co-Author: Zach Papiez, Magnalytix, LLC
AI Applications in Inspection: Enhancing SMT Manufacturing Inspection
David Chiu, Test Research, Inc (TRI)
Co-Author: Roberto Yebra, Test Research, Inc (TRI)
Mitigation Strategies for Failures Resulting from Ionizing Radiation
David Kruidhof, Comet Technologies USA, Inc.
Co-Author: Vineeth Bastin, Comet Technologies USA, Inc.
Need for Speed: Boosting X-Ray Inspection Speed in Advanced Electronics
Chris Nicholson, Ph.D., Comet X-Ray
Co-Author: Anthony Williams, Comet X-Ray
AOI Should Not Be Used as a Pass/Fail Gate: Applying SPC Principles to Inspection Data for Earlier Root Cause Identification in SMT
Jeremy Orbach, Omron Automation Americas
AI-Native Automated Optical Inspection: Sub-10-Minute Programming for New Boards with Low False-Call Rates
Collin Stoner, Selene Photonics Inc.
Flying Probe Nodal Impedance Testing
Matt Turpin, Datest Corporation
A Three-Camera Based Digital Image Correlation System for Warpage Measurement and CTE Distribution Analysis
Tanner Walrath, BSME, Dantec Dynamics
Co-Author: LiKang Luan, Dantec Dynamics
Root Cause Analysis of NVMe Slot Speed Degradation in Gen4 Backplane Boards: From Inconclusive X-Ray to PCB Dielectric and Glass Weave Defects
Zhipeng Wang, IBM Corporation
Counterfeit Detection as an AI-Based AOI Software Add-On
Eyal Weiss, Ph.D., Cybord
FCT for RF/High Speed Applications with Test Probes: Strategies, Pitfalls and How to Avoid Those
Matthias Zapatka, INGUN USA, Inc.
LTS
Low Temperature Solder (LTS) Track
Electrical Resistivity and Microstructure of Sn-Bi Solder
Eric Cotts, Ph.D. & Frances Holcomb, Binghamton University
Co-Author: Silas Wieland, Binghamton University
Reliability Performance and Challenges of Bi-Sn Based Homogeneous Low Temperature Solder Joints
Choongpyo Jeon, Samsung Electronics
Co-Authors: Soojin Yoo, Seungjin Oh, Keunho Rhew, Yuchul Hwang, Kichul Chun, Samsung Electronics
Lead-Free Flux-less Soldering Below 120°C
Martijn Mulder, Mat-Tech BV
Co-Authors: Arthur Miles, Mo Biglari, Alexandre Kodentsov, Mat-Tech BV
Low to Mid-Temperature Solder Preforms for Power Package Bond Applications
Francis Mutuku, Ph.D., Indium Corporation
Co-Authors: Liam Evans, Hongwen Zhang, Joseph Hertline, Ryan Mayberry, Indium Corporation
Deformation and Damage Properties of Solder Joints Reflowed at Temperatures Between 80°C and 140°C
Sai Reddy Munnangi, Ph.D., Binghamton University
Co-Authors: Anola Semndili, Ronit Das, Shantanu Joshi, Peter Borgesen, Binghamton University
Mitigating Solder Joint Defects Caused by the Warpage of BGA Assembly with Lower Temperature Soldering Phase III: Selection of Ball Alloys and TCT Reliability
Hongwen Zhang, Ph.D., Indium Corporation
Co-Authors: Danyang Zheng, Ph.D., Cassandra Goppert, Mengyao Wen, Yifan Wu Ph.D., Francis Mutuku Ph.D., Indium Corporation
MFX
Manufacturing for Excellence (MFX) Track
Reliability Evaluation of Low-Silver Solder Alloy Solder Paste
Jasbir Bath, Koki Solder America Inc.
Co-Authors: Yuki Yamamoto, Kimiaki Mori, Satoshi Otani, Noriyoshi Uchida, Shantanu Joshi, Jerome McIntyre, Koki Solder America Inc.
Impact of Operation Environment and Flux Residues on the Surface Insulation Resistance of In Bi SAC Solder Paste
Sirine Bayram, Ph.D., AIM Solder
Process Characterization for Determining Acceptable Levels of Flux Residue
Mike Bixenman, Ph.D., Magnalytix, LLC
Co-Author: Matt Imburgia, Magnalytix, LLC
A Mixed Powder Strategy to Improve Printing and Eliminate Nitrogen in Reflow
Mathilde Buret, Inventec Performance Chemicals
Co-Authors: Yvan Bouyou, Mélanie Mathon, Emmanuelle Guene, Inventec Performance Chemicals
Impact of Stencil Aperture Geometry and Printing Parameters Study via DOE and RSM on Solder Ball Mitigation in Mass SMT Production
Kamalesh Chavan, Binghamton University
Co-Authors: Christopher Greene, Ph.D., Binghamton University; Vladimir Caruz, Penguin Solutions
Impact of Fixture Material on Thermal Stability and Process Performance in Reflow Soldering
Ricardo Chuma, 2B AUTOMACAO E USINAGEM
The Science of Bonding
Dave Dworak, Dymax Corporation
Manufacturing Readiness: The Six Pillars of Operational Excellence
Mark Dydyk, Mark Dydyk Consulting LLC
Assessing SMT Component Compatibility and Reliability in Assembly and Cleaning Processes
Chelsea Jewell, KYZEN Corporation
Co-Author: Nicholas Ostrom, Lockheed Martin
Controlling Risk Beyond the PCBA: Applying Validation and Traceability to High Level Assembly in Regulated Industries
Sanjeev Katiyar, Spartronics
How Heavy Copper Designs Influence Through-Hole Barrel Fill
Mei Ming Khaw, Keysight Technologies
Co-Author: Xi Lin, Por, Keysight Technologies
Industrial AI in Electronics Manufacturing: A Comprehensive Review of State-of-the-Art Applications, Challenges, and Future Directions
Sai Kolli, Foxconn Industrial Internet (FII)
The Dirty Dozen - 12 Common Mistakes Made When Cleaning Circuit Assemblies
Mike Konrad, Aqueous Technologies
Human vs. AI-Collaborative PCB Design: Comparative Analysis of Routing Efficiency and Manufacturing Performance
Athula Kulatunga, Ph.D. & Jagadish Kirla, Purdue University Northwest
Are Gaps Bad for Printing?
Hong Kim Lee, Indium Corporation
SMT Defects Bringing You Down? We’ve Got Solutions
Tony Lentz, FCT Solder & Greg Smith, Stentech
Conformal Coating - Between De-Wetting and Crystalline Growth: The Quality Problem Identification by FT-IR Spectroscopy
Viktoria Rawinski, Rawinski GmbH
Shelf-Life Study of Near-Chip Connectors on PCB and in Tape and Reel
Tony Sass & Christine Taylor, Ph.D., IBM Corporation
Solder Powder Size Types and Their Associated Print Capabilities in Ultra High Density Applications
Chrys Shea, Shea Engineering Services
Co-Authors: Shantanu Joshi, Michael Butler, Koki Solder America
Solving SMT Component Attrition at Scale Using LLM-Based Agentic Analysis
Cameron Sobie, Ph.D., Arch Systems
Co-Authors: Andrew Scheuermann, Tim Burke, Arch Systems
Enhanced Design Rules and Optimization for Laser Depaneling
Patrick Stockbruegger, M.Sc., LPKF Laser & Electronics SE
Co-Author: Jake Benz, LPKF Laser & Electronics SE
Comparative Evaluation of Eutectic and Non-Eutectic Lead-Free Alloy Behavior in Hand Soldering Applications
Gayle Towell, AIM Solder
Co-Authors: Kevin Pigeon, Lauren Porto, Leo Lambert, Marcia McLaughlin
The Effect of Viscosity on Solder Paste Performance
Gayle Towell, AIM Solder
Don't Change It Yet: A Data-Driven Framework for Extending Cleaning Agent Bath Life
Ram Wissel, KYZEN Corporation
The Challenge and Solution for Automation of Straddle Mount Connector Assembly in Card Assembly
Wayne Zhang, IBM Corporation
Co-Authors: Theron Lewis, Robin Hou, Andrew Chong, Alex Chan, Kenny Chew, Venothraaj Rajandran, Ridwan Muhamad, Chin Kar Heng, William Chong Sook Kean, Mustaza Abdul Malik, Muhammad Syahmi Shafidin, Mohd Nasrul Ismail, Thinagaran Selvan, Vijia Nant, IBM Corporation
RHE
Reliability & Harsh Environments (RHE) Track
Mission Planning and Digital Twin Workflow for Thermo-Mechanical Solder Fatigue Prediction of Electronics
Josh Akman, Synopsys
Co-Authors: Mina Karimaghaei, Ian Pond, Synopsys
Active Condensation Exposure and the Reliability of Solvent-Free Conformal Coatings
Andrea Charif, Ph.D., Henkel Corporation
Co-Authors: Rita Mohanty, Alejandro Sanchez
A Comparative Study of Mechanical Behavior of Next Generation Lead-Free Solder Alloys
Pritha Choudhury, Ph.D., MacDermid Alpha Electronics Solutions India Pvt. Ltd.
Co-Authors: Anil Kumar, Lijia Xie, Sean Yenyu Lai, Ganesh Subbarayan, John Blendell, MacDermid Alpha Electronics Solutions
The Effect of Component Construction and Microstructure on the Thermal Cycling Performance of Reverse Hybrid Ball Grid Array Assemblies
Richard Coyle, Ph.D., Nokia Bell Labs
Co-Authors: See abstract for full author listing
Simulating Reflow Deformation on Highly Complex Printed Circuit Board Designs
Tyler Ferris, Ansys, Part of Synopsys
Ball Grid Array Footprint Impacts on Reliability
William Fox & Ben Gumpert, Lockheed Martin
Microstructure Evolution and Failure Mechanisms in High Performance Solder Alloys During Harsh Thermal Cycling
Chris Gourlay, Ph.D., Imperial College London
BGA Solder Joint Solder Joint Reliability Degradation From Incorrect Conformal Coating Processes
David Hillman, Hillman EAS LLC
Co-Author: Ross Wilcoxon, Collins Aerospace
How to Know if Your Conformal Coating Process Is Good or Not
Jason Keeping, P.E., Celestica Inc.
Atomic Layer Deposition/Parylene Conformal Nanocoatings for Robust Corrosion Protection of Electronics
Rakesh Kumar, Ph.D., Specialty Coating Systems, Inc.
Electromigration Behavior of Solder Joints as a Function of Current Density and Joint Temperature
Nithin Lakshminarayan, Universal Instruments Corporation
Co-Authors: Michael Meilunas, Universal Instruments Corporation; Martin Anselm, Ph.D., Rochester Institute of Technology (RIT)
RoHS: Twenty Years Later
Ronald Lasky, Ph.D., P.E., Indium Corporation
Comparison of Analytical Thermomechanical Modeling and Finite Element Analysis for Lead-Free Wafer-Level Packages Subjected to Temperature Cycling
Jean-Baptiste Libot, Ph.D., Hooke Electronics
Co-Author: Philippe Milesi, Hooke Electronics
Revisiting Silver-Content in Lead-Free Alloys: Reliability of Low-Cost Alternatives to SAC305 in Modern Electronics Assembly
Anna Lifton, MacDermid Alpha Electronics Solutions
Co-Authors: Kennedy Fox, Suraj Saifullah, Ebad Rehman, MacDermid Alpha Electronics Solutions
Conformal Coating Reliability for Harsh Environments
Jayse McLean, John Deere Intelligent Solutions Group
Sinusoidal Vibration Testing of Wafer Level Chip Scale Packages
Jayse McLean, John Deere Intelligent Solutions Group
Advanced Packaging Qualification for Harsh Environments
Gilad Nave, Ph.D., SLB
Co-Authors: Masahiro, Tsuriya, iNEMI; David Locker, US Army
Impact of Surface Finish on Voiding in Mixed Alloy Solder Paste Systems
Thuy Nguyen, Indium Corporation
Co-Authors: Ronald Lasky, Ph.D., P.E., Hongwen Zhang, Adam Murlin, Indium Corporation
The Impact of Conformal Coating on the Reliability of Solder Interconnects
Michael Osterman, Ph.D., CALCE/University of Maryland
Defects in Conformal Coatings
Doug Pauls, ItDepends Electronics LLC
Co-Author: Deb Vorwald, Collins Aerospace
A Metamodel for Screening Solder Fatigue Life of BGA Joints with Voids
Arvind Purushotaman, Synopsys
Co-Author: Josh Akman, Synopsys
A Review on Impact of Isothermal Aging on Thermal Cycling Reliability of Ball Grid Array Packages Assembled Using SAC Lead-Free Solder Alloy
Anto Raj, Ph.D., Medtronic
Co-Author: Richard Coyle, Ph.D., Nokia Bell Labs
Effect of Standoff Height, Pitch, and Component Type on Conformal Coating Ingress and Solder Joint Reliability in BGA and BTC Assemblies
Suraj Saifullah, MacDermid Alpha Electronics Solutions
Co-Authors: Kennedy Fox, Anna Lifton, MacDermid Alpha Electronics Solutions
Effects of Thermal Cycling on Electromigration Life of SnAgCu Solder Joints
Anola Semndili, Binghamton University
Co-Authors: Sai Kiran Reddy Munnangi, Sitaram Panta, Eric Cotts, Ph.D., Peter Borgesen, Binghamton University
A New Approach to the Design of Lead-Free Solder Alloys
Keith Sweatman, P.E., Nihon Superior Co., Ltd
Co-Authors: Kazuhiro Nogita, University of Queensland, Australia; Tetsuro Nishimura, Nihon Superior Co., Ltd
Effect of Bismuth and Antimony Additions on the Shear Properties of ENIG-Finished SAC Individual Solder Joints
Waad Tarman, Auburn University
Co-Authors: John Evans, Ph.D., Auburn University; Sa'd Hamasha, Ph.D., Binghamton University
High Density Connector Solder Joint Producibility and Reliability Evaluation for
Military & Aerospace Environments
Jacob Weber & Daphne Gates, Collins Aerospace
Co-Authors: Kimera Cho, Colette Anctil, John Halverson, Tim Pearson, Ross Wilcoxon, Collins Aerospace
Improving the Mechanical Reliability of a SAC305 Solder Joint by Using Different SAC Solder Pastes and Additional Doping Elements
George Winstead, Ph.D., Leidos Matching Gift Program
Co-Authors: Sa’d Hamasha, Ph.D., John Evans, Ph.D., Auburn University