ENGAGE, EDUCATE, INSPIRE, ADVANCE
CALL FOR ABSTRACTS
OCTOBER 19 - 23, 2025
DONALD E. STEPHENS CONVENTION CENTER
ROSEMONT, ILLINOIS, USA
We need your leadership and expertise to help us shape the 2025 technical program as the manufacturing and assembly community gathers to learn about innovations, solutions, and advancements in your areas of focus.
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RESEARCH
SHOWCASE YOUR
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Position yourself and your company as an innovative leader by sharing research, solutions, and strategies that can help electronics professionals navigate the evolving and challenging environment and forge a new path forward.
DEADLINE TO SUBMIT: APRIL 30, 2025
SMTA seeks abstracts that reflect sound learning principles and the best thinking in the field, informed by research and practice.
Your abstract should define the components of your paper including title and text, and be a maximum of 500 words. A single figure or table that supports your abstract submission may be included.
Please Note: All abstracts submitted for consideration must represent original research that has not been previously published in an industry event or media publication. We believe that this policy ensures that the SMTA International technical conference remains at the forefront of the electronics manufacturing and assembly industry. Accepted speakers will be required to submit a full technical paper and register for the conference at a discounted rate.
TECHNICAL PAPER AND PRESENTATION
Submit your abstract for the SMTA International Conference, the industry's leading technical program.
CONFERENCE TECHNICAL TRACKS
ADVANCED PACKAGING (APT)
Advances in 1st level packaging & assembly
ADDITIVELY MANUFACTURED ELECTRONICS (AME)
Advances in additive process –
methods, recipes, materials, assembly & reliability
LOW TEMPERATURE SOLDER (LTS)
Developments that can enable reflow soldering
at peak temperatures below 220°C
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MANUFACTURING FOR EXCELLENCE (MFX)
Current project work in manufacturing process areas
RELIABILITY AND HARSH ENVIRONMENTS (RHE)
Reliability testing materials and technologies for developers & users
TEST AND INSPECTION (INS)
Ensuring product reliability short & long-term
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WOMEN'S LEADERSHIP PROGRAM (WLP)
Promote diversity in engineering fields
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FEATURE SESSIONS
Panel discussions, Ultra High Density Interconnect (UHDI)
PROFESSIONAL DEVELOPMENT COURSE
Proposals are also being solicited from individuals interested in teaching professional development courses related to surface mount technology, advanced packaging, and electronics manufacturing.
Courses will be schedule as half day, 3.5 hours. Please include a course overview, topics covered, and suggested audience in your abstract
POSTER / INTERACTIVE PRESENTATION
Have a great project you’d like to share? Showcase your work at SMTA International 2025!
Submit a project description of 150 words or less summarizing your research. Interactive presentations must be previously unpublished and non-commercial.
DEADLINE TO SUBMIT: AUGUST 31, 2025
