CALL FOR ABSTRACTS
Technical Conference: October 21 - 24
Rosemont, Illinois, USA
The annual SMTA International Conference brings together professionals from around the globe to DISCUSS, COLLABORATE & EXCHANGE vital information to further all aspects of the electronic manufacturing industry.
- Share Your Research -
Abstracts Due April 30, 2024
Abstract acceptance notifications will be sent to speakers in July 2024
Technical Paper & Presentation
Submit an abstract for the SMTA International Conference, the industry's leading technical program. Join global professionals to discuss and exchange vital information, advancing the electronic manufacturing industry.
For your abstract submission:
Your abstract should define the components of your paper including title and text and be a maximum of 500 words. A single figure or table that supports your abstract submission may be included.
Professional Development Course
Proposals are also being solicited from individuals interested in teaching professional development courses related to surface mount technology, advanced packaging, and electronics manufacturing.
Courses will be scheduled as half day, 3.5 hours. Please include a course overview, topics covered, and suggested audience in your abstract.
Please Note:
All abstracts submitted for consideration must represent original research that has not been previously published in an industry event or media publication. We believe that this policy
ensures that the SMTA International technical conference remains at the forefront of the electronics manufacturing and assembly industry.
Accepted speakers will be required to submit a full technical paper (minimum of 4 pages) and register for the conference at a discounted rate.
SMTA does not book or reimburse travel expenses.
Call for Interactive
Presentations
Have a great project that you'd like to share?
Showcase your work at SMTA International!
Poster Submission Requirements:
Submit a project description of 150 words or less summarizing your research. Interactive presentations must be previously unpublished and non-commercial.
Submission Deadline: August 31, 2024.
Technical Conference Tracks
Advanced Packaging (APT) Track
Advances in 1st level packaging and assembly
Additively Manufactured Electronics (AME) Track
Advances in additive process – methods, recipes, materials, assembly, and reliability
Low Temperature Solder (LTS) Track
Developments that can be reflow soldered below 200°C
Manufacturing for Excellence (MFX) Track
Current project work in manufacturing process areas
Medical & Defense Symposium (MD)
Current work and advancements in the medical and defense sectors
Reliability and Harsh Environments (RHE) Track
Reliability testing materials and technologies for developers & users
Test and Inspection (INS) Track
Verifying Workmanship; Validating Design Adherence, Function, and Compliance; Predicting Short- & Long-Term Reliability
Women's Leadership Program (WLP)
Promote diversity in engineering fields