Call for Abstracts

Technical Conference: October 9 - 12
Minneapolis, Minnesota, USA

The annual SMTA International Conference brings together professionals from around the globe to DISCUSS, COLLABORATE & EXCHANGE vital information to further all aspects of the electronic manufacturing industry.

- Share Your Research -

Still Accepting Abstracts

Abstract acceptance notifications will be sent to speakers in July 2023

Submit an abstract at the Electronic Manufacturing industry's LARGEST technical program

Submit Paper Abstract

Conference

We invite you to submit an abstract at the industry's largest technical program, the SMTA International Conference! SMTA International brings together professionals around the world to discuss, collaborate, and exchange vital information to further all aspects of the electronic manufacturing industry.

Submit Course Abstract

Professional Development

Proposals are also being solicited from individuals interested in teaching professional development courses related to surface mount technology, advanced packaging, and electronics manufacturing.

Please Note:

All abstracts submitted for consideration must represent original research that has not been previously published in an industry event or media publication. We believe that this policy ensures that the SMTA International technical conference remains at the forefront of the electronics manufacturing and assembly industry. Accepted speakers will be required to submit a full technical paper and register for the conference at a discounted rate.

Technical Conference Tracks

Advanced Packaging (APT) Track

Advances in 1st level packaging and assembly

High Performance and Reliability (HPR) Track

Materials and technologies for developers & users

Materials for Electronics (MAT) Track

New materials used in electronics assembly

Interconnect Research and Reliability (IRR) Symposium

Reliability testing and evaluation of soldering

Women's Leadership Program (WLP)

Promote diversity in engineering fields

Test and Inspection (INS) Track

Ensuring product reliability short & long-term

Low Temperature Solder (LTS) Track

Developments that can be reflow soldered below 200°C

Manufacturing for Excellence (MFX) Track

Current project work in manufacturing process areas

Technical Innovations (TI) Symposium

Manufacturability and reliability of electronic circuit boards