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Audience and Lecturer

CALL FOR ABSTRACTS

Technical Conference: October 21 - 24

Rosemont, Illinois, USA

The annual SMTA International Conference brings together professionals from around the globe to DISCUSS, COLLABORATE & EXCHANGE vital information to further all aspects of the electronic manufacturing industry.

- Share Your Research -

Abstract acceptance notifications will be sent to speakers in June 2024

Technical Paper & Presentation

Submit an abstract for the SMTA International Conference, the industry's leading technical program. Join global professionals to discuss and exchange vital information, advancing the electronic manufacturing industry.

For your abstract submission:
Your abstract should define the components of your paper including title and text and be a maximum of 500 words. A single figure or table that supports your abstract submission may be included.

Professional Development Course

Proposals are also being solicited from individuals interested in teaching professional development courses related to surface mount technology, advanced packaging, and electronics manufacturing.

Courses will be scheduled as half day, 3.5 hours. Please include a course overview, topics covered, and suggested audience in your abstract. 

Please Note:

All abstracts submitted for consideration must represent original research that has not been previously published in an industry event or media publication. We believe that this policy

ensures that the SMTA International technical conference remains at the forefront of the electronics manufacturing and assembly industry.  

Accepted speakers will be required to submit a full technical paper (minimum of 4 pages) and register for the conference at a discounted rate.

SMTA does not book or reimburse travel expenses.

Call for Interactive
Presentations

Have a great project that you'd like to share?

Showcase your work at SMTA International!

Poster Submission Requirements:

Submit a project description of 150 words or less summarizing your research. Interactive presentations must be previously unpublished and non-commercial.

 

Submission Deadline: August 31, 2024. 

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Technical Conference Tracks

Advanced Packaging (APT) Track

Advances in 1st level packaging and assembly

Additively Manufactured Electronics (AME) Track

Advances in additive process – methods, recipes, materials, assembly, and reliability

Low Temperature Solder (LTS) Track

Developments that can be reflow soldered below 200°C

Manufacturing for Excellence (MFX) Track

Current project work in manufacturing process areas

Medical & Defense Symposium (MD)

Current work and advancements in the medical and defense sectors

Reliability and Harsh Environments (RHE) Track

Reliability testing materials and technologies for developers & users

Test and Inspection (INS) Track

Verifying Workmanship; Validating Design Adherence, Function, and Compliance; Predicting Short- & Long-Term Reliability

Women's Leadership Program (WLP)

​Promote diversity in engineering fields

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