ENGAGE, EDUCATE, INSPIRE, ADVANCE
TECHNICAL ADVISORY COMMITTEE
The distinguished SMTA International Technical Advisory Committee includes electronics manufacturing and packaging experts representing all facets of the industry. The Committee designed the conference program to ensure that today's latest trends and developments are fully addressed. They are an important component of the SMTA Brain Trust.
CONFERENCE EXECUTIVES
TRACK DIRECTORS
Raiyo Aspandiar, Ph.D., Intel Corporation - LTS Track Director
Robert Boguski, Datest Corporation - INS Track Co-Director
Keith Bryant, KB Consultancy - INS Track Co-Director
Burton Carpenter, NXP Semiconductors - APT Track Director
Richard Coyle, Ph.D., Nokia Bell Labs - RHE Track Co-Director
Priyanka Dobriyal, Ph.D., LightMatter - WLP Track Director
Jeffrey Kennedy, ZESTRON Corporation - MFX Track Director
Robert Kinyanjui, Ph.D., John Deere Electronics Solutions Inc. - RHE Track Co-Director
Pradeep Lall, Ph.D., Auburn University - AME Track Director
TECHNICAL COMMITTEE MEMBERS
Advanced Packaging (APT) Track
Lars Boettcher, Fraunhofer IZM Berlin
Mumtaz Bora, pSemi
Michelle Brown, Continental
Burt Carpenter, NXP Semiconductors
Marie Cole, IBM Corporation (retired)
MP Divakar, Stack Design Automation
Pradeep Lall, Auburn University
Andrew Mawer, NXP Semiconductors
Kunal Shah, Ph.D., Lilotree
Lavanya Swaminathan, Intel Corporation
Vasu Vasudvan, Dell
Chuck Woychik, NHanced Semiconductors
Albert Wu, National Central University
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Additively Manufactured Electronics (AME) Track
Evan Griffith, Indium Corporation
Pradeep Lall, Auburn University
Tom Rovere, Lockheed Martin
Douglas Schardt, Komori America Corp
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Test and Inspection (INS) Track
Rob Boguski, Datest Corporation
Keith Bryant, KB Consultancy
Evstatin Krastev, Ph.D., Nordson
Rita Mohanty, Ph.D., Henkel Corporation
Agustin Vasquez, Intel Corporation
Low Temperature Solder (LTS) Track
Raiyo Aspandiar, Intel Corporation
Srinivas Chada, General Dynamics
Ron Lasky, Ph.D., P.E., Indium Corporation
Jean-Baptiste Libot, Ph.D., Hooke Electronics
Anthony Rafanelli, Ph.D., P.E., Engineering Consultant
Prabjit Singh, IBM Corporation
Gayle Towell, AIM Solder
Watson Tseng, Shenmao Technology Inc.
Paul Wang, Ph.D., MiTAC Computer Technology
Manufacturing for Excellence (MFX) Track
Colete Anctil, Collins Aerospace
Richard Brooks, Spartronics Brooksville LLC
Moss Dore, Valeo
Saurabh Gupta, Ph.D., Intel Corporation
Jeff Kennedy, ZESTRON Corporation
Mei-Ming Khaw, Keysight Technologies
Sai Kolli, Watson Institute for System Excellence, Binghamton University
Mike Konrad, Aqueous Technologies
Patrick Lawrence, ITW EAE
Tony Lentz, FCT Solder
Adam Murling, Indium Corporation
Tim Pearson, Collins Aerospace
Scott Priore, Cisco Systems
Viktoria Rawinski, Rawinski GmbH
Prathik Rudresh, Vicor Power
Chrys Shea, Shea Engineering Services, Inc.
Vladimir Sitko, PBT Works s.r.o.
Gregory Vance, Rockwell Automation
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Reliability and Harsh Environments (RHE) Track
Joshua Akman, Ansys
Bill Capen, Honeywell
Jean Clech, EPSI, Inc.
Laura Cohen, Ph.D., Woodward
Richard Coyle, Nokia Bell Labs
Chloe Feng, Nokia Bell Labs
Kelly Flanagan, Rockwell Automation
Christopher Genthe, Rockwell Automation
David Hillman, Hillman Electronic Assembly Solutions LLC
Donghyun Kim, Ph.D., Nokia Bell Labs
Robert Kinyanjui, Deere & Company
Melanie Mathon, INVENTEC PERFORMANCE CHEMICALS
Jayse McLean, John Deere Intelligent Solutions Group
Anto Raj, Medtronic
Joerg Trodler, Dipl.-Ing., Trodler-EAVT
Ram Wissel, KYZEN Corporation
Women's Leadership Program (WLP)
Elizabeth Benedetto, HP, Inc.
Debbie Carboni, KYZEN Corporation
Priyanka Dobriyal, LightMatter
Marie Cole, IBM Corporation (Retired)
Michelle Ogihara, Seika Machinery, Inc.
Tanya Martin, CMP, SMTA
Jessica Molloy, ZESTRON Americas
Karlie Severinson, SMTA
Julie Silk, Keysight Technologies, Inc.
Sherry Stepp, KYZEN Corporation