Half day educational courses (PDCs) are led by internationally respected professionals with extensive experience in the subject area. Course instructors deliver focused, in-depth presentations on topics of current importance to the industry, based on their research and industry experience. Professional Development Courses are application oriented and structured to combine field experience with scientific research to solve everyday problems. All courses are scheduled as LIVE, in-person classes.

This PDC provides details on current and future assembly 3D packaging processes and technologies.

This course helps assembly professionals boost productivity and quality by identifying key process issues and applying practical solutions for improved operational and financial performance.

This course demystifies no-clean flux technology and equips professionals with the knowledge to prevent electrochemical migration, select effective cleaning methods, and meet evolving cleanliness standards for reliable electronics manufacturing.

This course offers a structured overview of solder paste technologies, covering formulations, real-world performance, process adaptations, bonding alternatives, and reliability challenges.

This course covers key tips for selecting equipment to perform mechanical durability testing in extreme conditions, backed by strain measurement data.

This course equips participants with strategies to navigate the complexity of selecting solder pastes, using a scorecard to optimize reliability, reduce costs, and enhance product yields in electronics assembly.

This workshop reviews the IMCs associated with both SnPb and Pbfree soldering processes. Basic metallurgy of the IMC phases with case studies and their influences on solder joint reliability are also covered. 

The course offers a holistic understanding of solder joint reliability, equipping participants to drive competitive manufacturing and product reliability. Attendees are encouraged to bring their own selected systems for deliberation.

The course presents manufacturing processes, materials, quality and reliability info in terms understandable to engineering and non-engineering personnel. Chip packaging characteristics and drivers will be outlined.

This course tutorial will furnish the ‘Design for Manufacturing’ principles established for flexible and rigid-flex circuit fabrication.