Courses at a Glance
Get a snapshot of this year's course lineup and compare topics before exploring the full descriptions.
Why Take a Course?
Make the most of your conference experience with focused training designed to build knowledge, strengthen practical skills, and deliver insights you can apply immediately.
Expert-Led Learning
Learn from internationally recognized technical leaders
Application-Based Skills
Gain practical knowledge you can apply immediately
Focused Environment
Engage with instructors, ask questions, and learn alongside peers
Immediate Impact
Leave the conference with new solutions, skills, and confidence
Course Schedule
Courses run concurrently each day, choose one per day to attend.
Monday, October 26
8:30am - 12:00pm
PDC1
PDC2
PDC3
PDC4
Tuesday, October 27
8:30am - 12:00pm
PDC5
PDC6
PDC7
Thursday, October 29
8:30am - 12:00pm
PDC8
PDC9
PDC10
Monday Courses
Monday, October 26 • 8:30am - 12:00pm
PDC1
Solder Joint Voids: Impact on Bottom Terminated Components (BTCs) and Ball Grid Arrays Solder Joint Reliability
Dave Hillman
Hillman Electronic Assembly Solutions LLC
This workshop explores the impact of solder joint voids on BTC and BGA component reliability, covering materials, design considerations, and manufacturing processes for tin/lead and lead-free soldering processes. Participants will gain an understanding of the effects of voids on solder joint integrity, BTC and BGA reliability, and thermal performance.
PDC2
Mastering Intermetallics for Reliable Electronics
Jennie S. Hwang, Ph.D., D.Sc.
H-Technologies Group
This course provides a comprehensive understanding of intermetallic compound (IMC) formation, evolution, and control throughout the entire lifecyle of an electronic assembly, from reflow and storage to field service. Participants will explore the relationship between IMCs, solder alloys, surface finishes, component metallization, and long-term reliability, with practical insights connecting materials science fundamentals to real-world challenges.
PDC3
Data-Driven Solder Paste Qualification
Chrys Shea
Shea Engineering Services
This course introduces a data-driven approach to solder paste qualification using a structured scorecard methodology to evaluate candidate materials based on assembler-specific requirements. Participants will learn how to compare solder paste options, identify tradeoffs, optimize testing efficiency, and confidently select the best material for their manufacturing needs.
PDC4
Principles and Practice of Developing Soldering Profiles
Ray Prasad
SMT Principles and Practice
Based on IPC-7530, this course provides practical guidance on developing, measuring, and controlling thermal profiles to reduce soldering defects and improve product quality and reliability. Participants will learn best practices for creating profiles across various soldering processes, including reflow, wave, vapor phase, laser, and selective soldering.
Tuesday Courses
Tuesday, October 27 • 8:30am - 12:00pm
PDC5
AI-Powered Manufacturing: From Fundamentals to Factory Impact
Jennie S. Hwang, Ph.D., D.Sc.
H-Technologies Group
This course provides an accessible introduction to AI fundamentals how they're applied on the manufacturing floor. Participants will gain practical insights into AI concepts, real-world applications, and strategies for evaluating opportunities and challenges in implementing AI-powered manufacturing solutions. No prior AI experience required.
PDC6
Assembly: Best Practices for Improving Manufacturing Productivity
Jim Hall & Phil Zarrow
ITM Consulting
This course provides practical strategies for improving productivity, quality, and yield in electronic assembly operations. Participants will explore how non-optimal processes, materials, equipment, and procedures can impact manufacturing performance and financial success. The course identifies common assembly challenges and provides actionable solutions to optimize existing production lines and improve overall efficiency.
PDC7
Design and Assembly Process Challenges for Bottom Termination Components (BTCs) in Tin-Lead and Lead-Free Applications
Ray Prasad
SMT Principles and Practice
This course provides practical guidance for successfully implementing robust BTC assembly processes in both tin/lead and lead-free environments. Participants will learn how to address common design and manufacturing challenges, optimize solder paste printing and rework processes, and reduce the risk of field failures.
Thursday Courses
Thursday, October 29 • 8:30am - 12:00pm
PDC8
Test Probes and Test Fixtures 101 for ICT/FCT: Back to Basics
Matthias Zapatka & Travis Walker
INGUN USA, Inc.
This back-to-basics course provides a practical introduction to selecting and applying test probes and fixtures for successful printed circuit board assembly (PCBA) testing, including in-circuit test (ICT) and functional test (FCT). The course covers essential fixture and probe technologies, helping engineers, technicians, and test professionals understand the fundamentals needed to develop reliable test solutions.
PDC9
Practical PCB Strain Measurement for Reliability Evaluation
Takahiro James Hara
Kyowa Americas Inc.
The course provides an introduction to PCB strain measurement techniques used for evaluating the reliability and durability of electronic assemblies. Participants will learn the fundamentals of strain measurement, strain gauge selection and installation, data acquisition methods, and techniques for improving measurement accuracy. A hands-on session provides experience with installation, measurement setup, and real-time data collection.
PDC10
PCB Interposer Design Strategies for Heterogeneous System-in-Package Technology
Vern Solberg
Solberg Technology Consulting
This course provides PCB design engineers and manufacturing professionals with guidance on developing next-generation semiconductor packaging solutions, including 2D, 2.5D, and 3D System-in-Package (SiP) technologies and ultra-high-density interposers. Participants will gain insight into evolving package architectures, interposer technologies, and practical design approaches for future electronic systems.
