PROFESSIONAL DEVELOPMENT COURSES
AT A GLANCE
PDC 1-3
Sunday, October 19
PDC 4-6
Monday, October 20
PDC 7-10
Thursday, October 23
Half day educational courses (PDCs) are led by internationally respected professionals with extensive experience in the subject area. Course instructors deliver focused, in-depth presentations on topics of current importance to the industry, based on their research and industry experience. Professional Development Courses are application oriented and structured to combine field experience with scientific research to solve everyday problems. All courses are scheduled as LIVE, in-person classes.
​Sunday, October 19 | 1:30pm - 5:00pm
PDC 3: Assembly - Best Practices for Improving Manufacturing Productivity
Instructors: Jim Hall; Phil Zarrow,
ITM Consulting
This course helps assembly professionals boost productivity and quality by identifying key process issues and applying practical solutions for improved operational and financial performance.
​Monday, October 20 | 8:30am - 12:00pm
PDC 5: A Comprehensive Guide to Cleaning in the Age of No-Clean Flux
Instructors: Michael Konrad,
Aqueous Technologies
This course demystifies no-clean flux technology and equips professionals with the knowledge to prevent electrochemical migration, select effective cleaning methods, and meet evolving cleanliness standards for reliable electronics manufacturing.
​Thursday, October 23 | 8:30am - 12:00pm
PDC 7: Overview of Solder Paste Technologies: From Formulation to Process Optimization in SMT Assembly
Instructor: Melanie Mathon,
Inventec Performance Chemicals
This course offers a structured overview of solder paste technologies, covering formulations, real-world performance, process adaptations, bonding alternatives, and reliability challenges.
​Thursday, October 23 | 8:30am - 12:00pm
PDC 9: Mechanical Durability & Reliability Testing with Strain Gage Technology in Harsh Environments: High Voltage, Temperature & Hydrogen Pressure
Instructor: Takahiro Hara,
Kyowa Americas Inc.
This course covers key tips for selecting equipment to perform mechanical durability testing in extreme conditions, backed by strain measurement data.
Sunday, October 19 | 1:30pm - 5:00pm
PDC 2: A Data-Driven Solder Paste Qualification Process
Instructor: Chrys Shea,
Shea Engineering Services
This course equips participants with strategies to navigate the complexity of selecting solder pastes, using a scorecard to optimize reliability, reduce costs, and enhance product yields in electronics assembly.
​Monday, October 20 | 8:30am - 12:00pm
PDC 4: Intermetallic Compounds (IMCs) Basic Metallurgy and Impact on Product
Instructors: Dave Hillman,
Hillman EAS LLC
This workshop reviews the IMCs associated with both SnPb and Pbfree soldering processes. Basic metallurgy of the IMC phases with case studies and their influences on solder joint reliability are also covered.
​Monday, October 20 | 8:30am - 12:00pm
PDC 6: Solder Joint Reliability – Principle and Practice
Instructor: Jennie Hwang, Ph.D.,
H-Technologies Group
The course offers a holistic understanding of solder joint reliability, equipping participants to drive competitive manufacturing and product reliability. Attendees are encouraged to bring their own selected systems for deliberation.
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​Thursday, October 23 | 8:30am - 12:00pm
PDC 8: Introduction to Chip Packaging Materials and Processes
Instructor: Syed Ahmad
The course presents manufacturing processes, materials, quality and reliability info in terms understandable to engineering and non-engineering personnel. Chip packaging characteristics and drivers will be outlined.
​Thursday, October 23 | 8:30am - 12:00pm
PDC 10: Flex Circuit Design Principles -Circuit Design, Fabrication and SMT Assembly Processing
Instructor: Vern Solberg, Solberg Technical Consulting
This course tutorial will furnish the ‘Design for Manufacturing’ principles established for flexible and rigid-flex circuit fabrication.
