At a Glance
Explore this year's keynote lineup and jump ahead to learn more about each session.
Monday, October 26 | 8:30am - 9:30am
Room TBD — Level 2 of the DES Convention Center
AME KEYNOTE
INCLUDED WITH CONFERENCE REGISTRATION
Hybrid Electronics: Accelerating Innovation and Adoption
Hybrid electronics combines additive processes with conventional manufacturing to build electronics that traditional methods can't produce. This keynote looks at what it takes to move the technology from demonstration to production-ready manufacturing, and where the biggest opportunities for adoption sit today.
Nick Morris
Deputy Director of Technology, NextFlex
Dr. Nick Morris is the Deputy Director of Technology at NextFlex, the U.S. Manufacturing Innovation Institute for Hybrid Electronics. He leads the Institute's national technology roadmapping activities, oversees the NextFlex Project Call portfolio, and supports strategic technology development with government, industry, and academic partners to accelerate the innovation and adoption of Hybrid Electronics manufacturing technologies. Dr. Morris also serves as an ex officio member of the Joint Defense Manufacturing Technology Panel (JDMTP) Electronics Sub-Panel, helping coordinate manufacturing priorities across the U.S. defense community. Prior to joining NextFlex, he served as a Research Scientist at the Air Force Research Laboratory (AFRL), where his work focused on advanced materials and flexible electronics for defense applications. Dr. Morris has more than 17 years of experience in hybrid electronics research, advanced manufacturing, and technology commercialization. He holds B.S. and Ph.D. degrees in Mechanical Engineering from West Virginia University and is a registered U.S. patent agent with four issued U.S. patents.
Tuesday, October 27 | 9:00am - 10:00am
Room TBD — Level 2 of the DES Convention Center
MFX KEYNOTE
INCLUDED WITH CONFERENCE REGISTRATION
AI Infrastructure Technology — Driving Forces, Challenges & Key Directions
The AI infrastructure buildout is reshaping demands on silicon, packaging, and manufacturing. This keynote examines the driving forces behind that buildout, the technical challenges it creates for the electronics supply chain, and the key directions the industry is moving to meet them.
Jung H. Yoon, Ph.D.
Distinguished Engineer & CTO — Supplier Technology & Quality, IBM Corporation
Jung is a Distinguished Engineer & CTO of IBM Supply Chain. He is a recognized industry leading expert in DRAM, Flash, SSDs, and semiconductor devices, and drives technology convergence between industry capabilities and IBM’s strategic product offerings across IBM’s server infrastructure. Jung has over 30 years of experience in the field of Semiconductor R&D, technology enablement and quality. Jung earned his PhD in Solid State Physics from Columbia University, MS from University of California Berkeley, and a BS from Seoul National University.
Wednesday, October 28 | 9:00am - 10:00am
Room 13 — Level 1 of the DES Convention Center
KEYNOTE PANEL
FREE FOR ALL ATTENDEES
AI in Manufacturing
Co-presented with The Assembly Show
Roy Devadas
Head of Global IT Strategy & Frameworks, ITW
John Platais
Senior Manager — Data Science, ML Ops & Data Governance, Milwaukee Tool
Girish Gopalakrishnan
North America Senior Manager — Continuous Improvement, Case New Holland
Jung H. Yoon, Ph.D.
Distinguished Engineer & CTO — Supplier Technology & Quality, IBM Corporation