CHALLENGE #2
Depaneling - Micro Cracking
Scenario #2
After separating boards from the manufacturing panel, tiny cracks are discovered near several components.
Visit the exhibitor to learn:
What caused the damage?
How can depaneling methods reduce mechanical stress?
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Laser Marking
Low Contrast
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Wave Soldering
Barrel Fill
Handling
ESD Risk
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Depaneling
Micro Cracking
Selective Soldering
Icicles
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MES / MRP /Digital Twin / Factory Automation
Stencil Printing
Misprint
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Cleaning
Meet Organics Spec
& White Residue
Solder Station Equipment
Component Placement
Polarity & Placement
AOI
False Calls on
QFN Parts
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Conformal Coating
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Reflow Soldering
Tombstone
Rework
Manual Rework & Automated Rework
Expo Floor Map
Find your way to each station