CHALLENGE #2
Depaneling - Micro Cracking
Scenario #2
After separating boards from the manufacturing panel, tiny cracks are discovered near several components.
Visit the exhibitor to learn:
What caused the damage?
How can depaneling methods reduce mechanical stress?
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1. Laser Marking
Find a Marking Exhibitor
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6. Wave Soldering
Barrel Fill
11. Handling
Find an ESD or
Handling Exhibitor
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2.Depaneling
Micro Cracking
7. Selective Soldering
Find a Soldering Exhibitor
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12. MES / MRP /Digital Twin / Factory Automation
Find an Automation Exhibitor
3.Stencil Printing
Misprint
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8. Cleaning
Find a Cleaning
Exhibitor
13. Solder Station Equipment
4. Component Placement
Polarity & Placement
9. AOI
False Calls on
QFN Parts
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14. Conformal Coating
Find a PCB Protection Exhibitor
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5. Reflow Soldering
Tombstone
10. Rework
Find a Rework or
Repair Exhibitor
Expo Floor Map
Find your way to each station